August Gasslander

Focus on non-destructive and destructive testing of electronics, often with an aim of identifying the root cause of failure in faulty electronics, or the source of anomalies/defects during electronics production. Also performs quality inspection of electronic devices. Combines an understanding of electronics manufacturing, design, function and failure mechanisms with material analysis technique knowledge. Some of the most commonly performed analysis techniques are listed below.

Non-destructive testing (NDT): X-ray inspection, optical microscopy inspection, scanning acoustic microscopy (SAM) analysis, scanning electron microscopy / energy-dispersive X-ray spectroscopy (SEM/EDS).

Destructive testing: Microsectioning, cross-sectional analysis, Dye & Pry.

Typical electronics analysis tasks include solder joint analysis, constructional analysis, failure analysis, root cause analysis (RCA), and quality inspection.