Materials and failure analysis of electronics hardware

The extreme pace of development within materials and technology brings with it a large risk of mistakes and problems during electronics manufacturing. Failures that are not discovered in time can become very expensive. It is therefore important to discover, identify, analyse and rectify weaknesses in electronics manufacturing.

Test and quality control of electronics

We offer tests and quality control for development of products and processes during the development phase, in order to reduce development loops and achieve shorter time to market. Early failures due to design weaknesses and material/process related defects can be analysed using temperature and/or vibrational testing which stimulates defects to failure.

Ageing and wear related failures require accelerated tests designed to simulate the failure mechanism in order to enable the expected lifetime to be estimated.

Materials- and failure analysis

With our knowledge on processes, materials, and electronics packaging we find root cause in failed electronics and help rectify them. Non-destructive testing (NDT) techniques, such as optical microscopy, Microfocus X-ray, Scanning Acoustic Microscopy (SAM) and Scanning Electron Microscopy with Energy Dispersive Spectroscopy (SEM/EDS) is used, often followed by destructive analysis for result verification.