Saeed Akbari has a PhD in Mechanical Engineering from University of Toronto, Canada, and currently works as a senior scientist and project manager in electronics at RISE. His work is focused on electronics packaging and reliability, thermal management and electronics cooling, and application of additive manufacturing in electronics manufacturing. These include projects related to packaging and integration of wide band gap devices for high density power electronics applications, thermal cycling of electronic assemblies, cooling channels using copper additive manufacturing, ceramic printing for thermally efficient electronics packaging, stress and damage evolution in microelectronics packages, etc. Google Scholar: https://scholar.google.com/citations?user=I9lnU5AAAAAJ&hl=fa&oi=sra