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HyPELignum - Making greener electronics using wood materials

The HyPELignum project seeks to demonstrate that consumer electronics and internet of things solutions can be made more sustainable, by combining additive manufacturing and wood based materials.

The project will propose and demonstrate a holistic approach, from the sourcing of raw materials to the end of life, to manufacture net-zero carbon electronics. The project will aim to show how wood and wood-waste derived materials can be core (substrate, ink components) for the additive manufacturing of electronics. The project will also develop an energy-efficient microchip for sensing systems as well as look at new ways to recycle wood and recover electronic materials.

The HyPELignum project is funded by the European Union under Grant Agreement no. 101070302.

Supports the UN sustainability goals

9. Industry, innovation and infrastructure
12. Responsible consumption and production
13. Climate action
Valerio Beni

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Valerio Beni


+46 72 516 86 07

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