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Electronics packaging

We work in a number of areas supporting development and manufacturing of reliable electronic hardware. Our activities include electronics packaging, manufacturing techniques, process validation, reliability, test and verification as well as materials and failure analysis.

Packaged Silicon Carbide Power Module
Photo: Saeed Akbari
Packaged power module

System Integration for electronics

The activities within the unit includes studies of production, design, and packaging technologies for electronic systems.

The focus of the research is on analyses of processes and methods required for manufacturing and integration of electronics, optoelectronics, and microsystems. The purpose is to increase the knowledge base on interconnection, encapsulation, and packaging methods for electronic systems and components. We do this by using virtual models and simulations as well as experimental research.


  • Electronics packaging
  • Manufacturing technology
  • Process validation
  • Reliability assessments
  • Test and verification
  • Materials and failure analysis
  • Simulations
Klas Brinkfeldt

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Klas Brinkfeldt


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