Intelligent Reliability 4.0

The trend for system integration, especially for heterogeneous integration, is miniaturization. Thus, reliability becomes an increasing challenge on device and system level and faces exceptional requirements for future complex applications. Applications require customer acceptance and satisfaction at acceptable cost. Reliability must be guaranteed when using systems in new and critical environments. In iRel40, 79 partners from 14 countries collaborated in 6 technical work packages along the value chain from chip to systems.

WP1 focused on specifications and requirements.

WP2 and WP3 focused on modelling, simulation, materials and interfaces based on test vehicles.

WP4 applied the test vehicle knowledge to industrial pilots related to production.

WP5 applied the knowledge to testing.

WP6 focused on application use cases by applying the industrial pilots.

We assessed and validated the iRel40 results. Reliable electronic components and systems will be developed faster and new processes will be transferred to production with higher speed. Crucial insight gained by Physics of Failure and AI methods will push overall quality levels and reliability.