Per-Erik Tegehall
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Mölndal
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Systemintegration (102103)
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Publikationer
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Publikationer
- Impact of Surface Finish, Solder Volume and Solder Composition on the Grain Str…
- Transgranular crack propagation in thermal cycling of SnAgCu solder joints
- Effect of PCB cracks on thermal cycling reliability of passive microelectronic …
- Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition…
- The Stress State of BGA Solder Joints Influenced by the Grain Orientations of N…
- The impact of conformal coatings on the environmental protection of PCBassembli…
- On the formation and propagation of laminate cracks and their influence on the …
- Supervision unit for harsh environments
- Feasibility of PCB-integrated vibration sensors for condition monitoring of ele…
- Unit for Investigation of the Working Environment for electronic units in harsh…